Engineered to support the immense scale and unparalleled precision of ASML's High-NA EUV lithography systems, this machine base provides the critical foundation for next-generation semiconductor manufacturing. The expansive, heavily reinforced structure is designed for absolute stability, featuring a dense array of support points to manage the system's considerable weight and eliminate vibrations. The meticulously planned top surface includes precisely located mounting points and interfaces to seamlessly integrate the complex modules of the groundbreaking TWINSCAN EXE:5200, ensuring the picometer-level accuracy required to produce the world's most advanced microchips.