Precision Pedestal for Next-Generation EUV Lithography

Overview

Tool Platform: TWINSCAN NXE:3800E

Solution: Multi-level, ultra-stiff precision pedestal

Primary Benefit: Extreme stiffness, thermal stability, and vibration isolation

Application: Leading-edge semiconductor manufacturing

Customer & Application

Fulcrum engineered a custom machine base pedestal for a next-generation EUV lithography platform developed by ASML. The pedestal was designed to support higher-productivity EUV scanning systems where structural stiffness, thermal stability, and vibration control are essential to achieving aggressive performance targets in advanced chip manufacturing environments.

Challenge: Enabling Higher-Productivity EUV Performance

The NXE:3800E platform introduced increased performance demands, including higher throughput, tighter overlay tolerances, and support for advanced optical architectures. These requirements placed unprecedented demands on the machine base, which needed to deliver extreme stiffness while maintaining thermal stability and eliminating vibration. The pedestal also had to accommodate a complex tool layout, including precise interfaces and clearance zones for multiple subsystems across a multi-level footprint.

Fulcrum’s Engineered Solution

Fulcrum designed an intricate, multi-level pedestal engineered to create an ultra-precise, vibration-free environment for the NXE:3800E system. The precision-machined top plate incorporates carefully planned interfaces and clearance zones tailored to the scanner’s layout, ensuring seamless integration of all tool modules. A dense array of advanced support stanchions provides uncompromising stiffness and load distribution, while the overall structure delivers the thermal and vibrational stability required to support higher-NA optics and next-generation EUV performance.