Precision Pedestal for i-Line Lithography Systems

Canon 550iZ2

Canon 550iZ2 pedestal designed for high rigidity and precision support, featuring a reinforced steel structure and machined mounting surfaces for advanced lithography equipment

Overview

Tool Platform: FPA-5550iZ2

Solution: Compact, reinforced precision pedestal

Primary Benefit: Exceptional stability and vibration resistance

Application: High-precision i-line lithography processes

Customer & Application

Fulcrum engineered a custom machine base pedestal for a leading semiconductor equipment manufacturer supporting advanced i-line lithography platforms developed by Canon. The pedestal was designed to provide a highly stable, space-efficient foundation for critical wafer exposure processes where alignment accuracy and vibration control are essential to consistent tool performance.

Challenge: Stability for High-Precision Exposure

The 5550iZ2 i-line stepper required a rigid, vibration-resistant foundation capable of maintaining precise alignment during sensitive wafer exposure operations. The machine base also needed to match the tool’s specific footprint and interface requirements, including clearance constraints and mounting locations, without increasing the overall system footprint within the fab.

Fulcrum’s Engineered Solution

Fulcrum designed a compact, heavily reinforced pedestal tailored specifically to the FPA-5550iZ2 platform. The machine base features a precision-machined top surface with interfaces aligned exactly to the tool’s mounting points, ensuring accurate positioning and long-term stability. A distinctive notched corner accommodates the system’s unique layout requirements while maintaining structural rigidity. The reinforced construction delivers effective vibration damping, creating a solid foundation optimized for high-precision lithography.

Results

Delivered a stable, vibration-resistant foundation for i-line lithography tools

Ensured precise alignment through custom-machined interfaces

Maintained a compact footprint suited for fab integration

Supported consistent, high-quality wafer exposure performance

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